BS EN 61760-3-2010 表面安装技术.通孔回流(THR)焊接用组件规范的标准方法

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【英文标准名称】:Surfacemountingtechnology-Standardmethodforthespecificationofcomponentsforthroughholereflow(THR)soldering
【原文标准名称】:表面安装技术.通孔回流(THR)焊接用组件规范的标准方法
【标准号】:BSEN61760-3-2010
【标准状态】:现行
【国别】:英国
【发布日期】:2010-06-30
【实施或试行日期】:2010-06-30
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:紧隙硬钎焊接头;组件;合作;定义;电气工程;电子工程;电子设备及元件;架设(施工作业);指导手册;检验;处理;质量保证;回流焊接;表面安装设备;软钎焊连接;软钎焊设备;焊接点;钎焊;适宜性;表面安装;表面安装装置;试验;试验条件;通孔安装
【英文主题词】:Capillarybrazingjoints;Components;Coordination;Definitions;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Erecting(constructionoperation);Guidebooks;Inspection;Marking;Qualityassurance;Reflowsoldering;SMD;Solderedjoints;Solderingequipment;Solderingpoints;Solderings;Suitability;Surfacemounting;Surfacemountingdevices;Testing;Testingconditions;Trough-holemounting
【摘要】:ThispartofIEC61760givesareferencesetofrequirements,processconditionsandrelatedtestconditionstobeusedwhencompilingspecificationsofelectroniccomponentsthatareintendedforusageinthroughholereflowsolderingtechnology.Theobjectofthisstandardistoensurethatcomponentswithleadsintendedforthroughholereflowandsurfacemountingcomponentscanbesubjectedtothesameplacementandmountingprocesses.Hereto,thisstandarddefinestestandrequirementsthatneedtobepartofanycomponentgeneric,sectionalordetailspecification,whenthroughholereflowsolderingisintended.Furtherthisstandardprovidescomponentusersandmanufacturerswithareferencesetoftypicalprocessconditionsusedinthroughholereflowsolderingtechnology.
【中国标准分类号】:L10
【国际标准分类号】:31_190
【页数】:28P.;A4
【正文语种】:英语